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Plating Analyser

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The instrument with model number XRF-2000 is used for plating thickness measurement. It can detect the thicknesses of 5 different layers of plated metals at the same time. The accuracy can reach 0.01 micro-inch.  Superlink uses this instrument to control the plating quality of gold, silver, nickel, tin and ternary alloy applied to the RF connectors and components precisely.

Keywords in the article: Superlink    SLK   Hot-bar soldering   network analyzer    RF cable assemblies    SFP+    QSFP+ cable assemblies